Werth Messtechnik JiMEAS Technology Corp.
Request a demo

TGV (Through Glass Via)

Micro-halls that line the glass base vertically, structures used to connect circuits in advanced packaging to the enemy layer

Request a demo
Micro-halls that line the glass base vertically, structures used to connect circuits in advanced packaging to the enemy layer

The most important geological characteristics in TGV measurements are the location of the micro-hole, diameter, less than 100 μm), shape, shape, and orientation, as well as the flatness and thickness of the glass platform. In particular, a glass ceiling of about 600 mm × 600 mm size often requires 100% frontal inspection of up to one million micro-holes, ensuring a high structural separation efficiency and measurement speed within short cycle times. Werth's multi-sensorate coordinate metrology (MTM) technology combines the optical touch point sensor in a coordinate system, and the multi-sensor sensor can be used to scan multiple microscopes and microbes within the glass platform, or to accurately evaluate the depth of the glass at the same time.

Recommended systems

Talk to an expert

JiMEAS engineers design the optimal solution for measurement challenges specific to your industry.

Request a demo