TGV (Through Glass Via)
Micro-halls that line the glass base vertically, structures used to connect circuits in advanced packaging to the enemy layer
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The most important geological characteristics in TGV measurements are the location of the micro-hole, diameter, less than 100 μm), shape, shape, and orientation, as well as the flatness and thickness of the glass platform. In particular, a glass ceiling of about 600 mm × 600 mm size often requires 100% frontal inspection of up to one million micro-holes, ensuring a high structural separation efficiency and measurement speed within short cycle times. Werth's multi-sensorate coordinate metrology (MTM) technology combines the optical touch point sensor in a coordinate system, and the multi-sensor sensor can be used to scan multiple microscopes and microbes within the glass platform, or to accurately evaluate the depth of the glass at the same time.
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