Semiconductors
The position and junction of the IC and the calibration of the solder joint is one of the important geometric characteristics to be managed. As the assembly process is mostly automated, the demand for geometric shapes and measurement times is very high. Werth multi-sensor 3D meters are the optimal solution for measuring small and sensitive electronic components, for example, for the pre-scale weighing of the wafer, automatic machine positioning of machinery, or calibration of the lead assembly formed in the IC as a cumulative assembly.
